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  ? semiconductor components industries, llc, 2015 march, 2015 ? rev. 0 1 publication order number: NHPAF220/d NHPAF220, nrvhpaf220 surface mount ultrafast power rectifier this sma flat lead ultrafast rectifier provides fast switching performance with soft recovery in a compact thermally efficient package. its compact footprint makes it ideally suited to portable and automotive applications where board space is at a premium. its low profile makes it a good option for flat panel display and other applications with limited vertical clearance. the device offers low leakage over temperature making it a good match for applications requiring low quiescent current. features ? fast soft switching for reduced emi and higher efficiency ? low profile ? maximum height of 1.1 mm ? small footprint ? footprint area of 13.5 mm 2 ? nrv prefix for automotive and other applications requiring unique site and control change requirements; aec?q101 qualified and ppap capable ? these devices are pb?free, halogen free/bfr free and are rohs compliant mechanical characteristics: ? case: molded epoxy ? epoxy meets ul 94 v?0 @ 0.125 in ? weight: 95 mg (approximately) ? lead and mounting surface temperature for soldering purposes: 260 c maximum for 10 seconds ? msl 1 applications ? switching power supplies including mini?adapters and displays ? instrumentation ? engine control recirculation diodes ? freewheeling diode where space is at a premium device package shipping ? ordering information sma?fl case 403aa style 6 ultrafast rectifier 2.0 ampere 200 volts www. onsemi.com ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specification brochure, brd8011/d. NHPAF220t3g sma?fl (pb?free) 5000 / tape & reel p22 = specific device code a = assembly location y = year ww = work week  = pb?free package ayww p22   marking diagram nrvhp af220t3g sma?fl (pb?free) 5000 / tape & reel (note: microdot may be in either location)
NHPAF220, nrvhpaf220 www. onsemi.com 2 maximum ratings rating symbol value unit peak repetitive reverse voltage working peak reverse voltage dc blocking voltage v rrm v rwm v r 200 v average rectified forward current (t l = 130 c) i o 2.0 a peak repetitive forward current (rated v r , square wave, 20 khz) t l = 125 c i frm 4.0 a non?repetitive peak surge current (surge applied at rated load conditions halfwave, single phase, 60 hz) i fsm 60 a storage temperature range t stg ?65 to +175 c operating junction temperature t j ?65 to +175 c stresses exceeding those listed in the maximum ratings table may damage the device. if any of these limits are exceeded, device function ality should not be assumed, damage may occur and reliability may be affected. thermal characteristics characteristic symbol value unit thermal resistance, junction?to?lead (note 1)  jcl 29 c/w thermal resistance, junction?to?ambient (note 1) r  ja 80 c/w 1. 1 inch square pad size (1 0.5 inch) for each lead on fr4 board. electrical characteristics characteristic symbol value unit t j = 25 c t j = 125 c maximum instantaneous forward voltage (note 2) (i f = 2.0 a) v f 1.00 0.85 v maximum instantaneous reverse current (note 2) (v r = 200 v) i r 0.5 35  a reverse recovery time i f = 2.0 a, v r = 30 v, dl/dt = 50 a/  s, t j = 25 c t rr 30 ns reverse recovery time i f = 2.0 a, v r = 30 v, dl/dt = 50 a/  s, t j = 125 c t rr 50 ns product parametric performance is indicated in the electrical characteristics for the listed test conditions, unless otherwise noted. product performance may not be indicated by the electrical characteristics if operated under different conditions. 2. pulse test: pulse width 380  s, duty cycle 2.0%.
NHPAF220, nrvhpaf220 www. onsemi.com 3 typical characteristics figure 1. typical instantaneous forward characteristics figure 2. maximum instantaneous forward characteristics v f , instantaneous forward voltage (v) v f , instantaneous forward voltage (v) 1.1 0.9 1.5 0.7 0.5 0.3 0.1 0.001 1 10 100 1.2 0.8 0.6 0.2 0 0.001 1 10 100 figure 3. typical reverse characteristics figure 4. maximum reverse characteristics v r , instantaneous reverse voltage (v) v r , instantaneous reverse voltage (v) 180 120 100 80 60 40 20 0 1.e?12 200 140 120 80 40 20 0 figure 5. typical junction capacitance v r , reverse voltage (v) 0 10 100 1000 i f , instantaneous forward current (a) i r , instantaneous reverse current (a) c, junction capacitance (pf) 1.4 i f , instantaneous forward current (a) 140 200 1.e?11 1.e?09 1.e?08 1.e?06 1.e?05 1.e?03 60 100 1.e?09 1.e?08 1.e?07 1.e?05 1.e?03 i r , instantaneous reverse current (a) 20 200 t a = 175 c t a = 125 c t a = ?40 c t a = 25 c t a = 150 c t a = 125 c t a = ?40 c t a = 25 c t a = 150 c t a = 125 c t a = 25 c 1.e?04 figure 6. current derating t c , case temperature ( c) 100 60 160 140 20 0 0 0.5 1.0 2.0 3.5 4.0 i f(av) , average forward current (a) 2.5 40 120 square wave dc r  jc = 29 c/w t j = 25 c 1.3 0.4 1.0 160 t a = 150 c t a = 175 c t a = 175 c 0.1 0.01 0.1 0.01 t a = ?40 c 1.e?10 1.e?07 1.e?04 160 t a = 150 c t a = 125 c t a = 25 c t a = 175 c t a = ?40 c 180 40 60 80 100 120 140 160 180 1.5 3.0 80 180 1.e?06
NHPAF220, nrvhpaf220 www. onsemi.com 4 typical characteristics figure 7. forward power dissipation i f(av) , average forward current (a) 2.0 0 0 1.0 3.0 p f(av) , average forward power dissipation (w) t j = 175 c square wave dc i pk /i av = 5 i pk /i av = 20 i pk /i av = 10 0.5 1.0 1.5 0.5 1.5 2.0 2.5 0.001 0.01 0.1 1 10 100 0.0000001 0.000001 0.00001 0.0001 1000 0.001 0.01 0.1 1 10 100 figure 8. typical transient thermal response, junction?to?ambient t, pulse time (s) r (t) , typical transient thermal resistance ( c/w) 50% duty cycle 20% 10% 5% 2% 1% single pulse
NHPAF220, nrvhpaf220 www. onsemi.com 5 package dimensions sma?fl case 403aa issue o d e b l c solder footprint* dimensions: millimeters 5.56 1.76 *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. 1.30 recommended notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. dim min max millimeters a 0.90 1.10 b 1.25 1.65 c 0.15 0.30 d 2.40 2.80 top view e1 bottom view 2x 2x side view a c seating plane e 4.80 5.40 e1 4.00 4.60 l 0.70 1.10 on semiconductor and the are registered trademarks of semiconductor components industries, llc (scillc) or its subsidia ries in the united states and/or other countries. scillc owns the rights to a number of pa tents, trademarks, copyrights, trade secret s, and other intellectual property. a listin g of scillc?s product/patent coverage may be accessed at www.onsemi.com/site/pdf/patent?marking.pdf. scillc reserves the right to make changes without further notice to any product s herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for any part icular purpose, nor does sci llc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ?typi cal? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. all operating param eters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the right s of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgic al implant into the body, or other applications intended to s upport or sustain life, or for any other application in which the failure of the scillc product could create a situation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer s hall indemnify and hold scillc and its officers , employees, subsidiaries, affiliates, and dist ributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufac ture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. p ublication ordering information n. american technical support : 800?282?9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81?3?5817?1050 NHPAF220/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303?675?2175 or 800?344?3860 toll free usa/canada fax : 303?675?2176 or 800?344?3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your loc al sales representative


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